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d a t a sh eet product speci?cation supersedes data of 1998 aug 31 file under integrated circuits, ic24 1999 nov 23 integrated circuits 74ALVCH16543 16-bit d-type registered transceiver; 3-state
1999 nov 23 2 philips semiconductors product speci?cation 16-bit d-type registered transceiver; 3-state 74ALVCH16543 features in accordance with jedec standard no 8-1a cmos low power consumption direct interface with ttl levels multibyte ? flow-through pin-out architecture 16-bit transceiver with d-type latch combines 16245 and 16373 type functions in one chip back-to-back registers for storage output drive capability 50 w transmission lines at 85 c separate controls for data flow in each direction all data inputs have bus hold 3-state non-inverting outputs for bus oriented applications current drive 24 ma at 3.0 v. description the 74ALVCH16543 is a dual octal registered transceiver. each section contains two sets of d-type latches for temporary storage of the data flow in either direction. separate latch enable (n le ab , n le ba ) and output enable (n oe ab , n oe ba ) inputs are provided for each register to permit independent control in either direction of the data flow. the 16543 contains two sections each consisting of two sets of eight d-type latches with separate inputs and controls for each set. for data flow from a to b, for example, the a-to-b enable (n e ab , where n equals 1 or 2) inputs must be low in order to enter data from na 0 to na 7 , or take data from nb 0 to nb 7 , as indicated in the function table. with n e ab low, a low signal on the a-to-b latch enable (n le ab ) input makes the a-to-b latches transparent; a subsequent low-to-high transition of the n le ab signal stores the a data into the latches. with n e ab and n oe ab both low, the 3-state b output buffers are active and display the data present at the output of the a latches. similarly, the n e ba , n le ba and n oe ba signals control the data flow from b-to-a. active bus hold circuitry is provided to hold unused or floating data inputs at a valid logic level. function table see note 1. note 1. xx = ab for a-to-b direction, ba for b-to-a direction; h = high voltage level; l = low voltage level; h = high state must be present one set-up time before the low-to-high transition of n le ab ,n le ba ,n e ab or n e ba ; l = low state must be present one set-up time before the low-to-high transition of n le ab , n le ba , n e ab or n e ba ; x = dont care; nc = no change; - = low-to-high level transition; z = high-impedance off-state. inputs outputs status n oe xx n e xx n le xx nb n ,na n h x x x z disabled x h x x z disabled l - l h z disabled and latch l - ll z ll - h h latch and display ll - ll l l l h h transparent llll l l l h x nc hold
1999 nov 23 3 philips semiconductors product speci?cation 16-bit d-type registered transceiver; 3-state 74ALVCH16543 quick reference data ground = 0; t amb =25 c; t r =t f = 2.5 ns notes 1. c pd is used to determine the dynamic power dissipation (p d in m w). p d =c pd v cc 2 f i + s (c l v cc 2 f o ) where: f i = input frequency in mhz; c l = output load capacitance in pf; f o = output frequency in mhz; v cc = supply voltage in volts; s (c l v cc 2 f o ) = sum of outputs. 2. the condition is v i = gnd to v cc . ordering information pinning symbol parameter conditions typical unit t phl /t plh propagation delay na n ,nb n to nb n ,na n c l = 50 pf; v cc = 3.3 v 3.8 ns c i input capacitance 4.0 pf c pd power dissipation capacitance per latch notes 1 and 2 outputs enabled 44 pf outputs disabled 14 pf outside north america north america package temperature range pins package material code 74ALVCH16543dgg ach16543 dgg - 40 to +85 c 56 tssop plastic sot364-1 pin symbol description 1 and 28 1 oe ab , 2 oe ab output enable a-to-b for register 1 or 2 2 and 27 1 le ab , 2 le ab latch enable a-to-b for register 1 or 2 3 and 26 1 e ab , 2 e ab a-to-b enable for register 1 or 2 4, 11, 18, 25, 32, 39, 46 and 53 gnd ground (0 v) 5, 6, 8, 9, 10, 12, 13 and 14 1a 0 to 1a 7 data inputs/outputs 7, 22, 35 and 50 v cc dc supply voltage 15, 16, 17, 19, 20, 21, 23 and 24 2a 0 to 2a 7 data inputs/outputs 29 and 56 2 oe ba , 1 oe ba output enable b-to-a for register 1 or 2 30 and 55 2 le ba , 1 le ab latch enable b-to-a for register 1 or 2 31 and 54 2 e ba , 1 e ba b-to-a enable for register 1 or 2 33, 34, 36, 37, 38, 40, 41 and 42 2b 7 to 2b 0 data inputs/outputs 43, 44, 45, 47, 48, 49, 51 and 52 1b 7 to 1b 0 data inputs/outputs
1999 nov 23 4 philips semiconductors product speci?cation 16-bit d-type registered transceiver; 3-state 74ALVCH16543 fig.1 pin configuration. handbook, halfpage 16543 mna297 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 52 51 50 55 56 54 53 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 27 28 gnd 1a 0 1a 1 v cc 1a 2 1a 3 1a 4 gnd 1a 5 1a 6 1a 7 2a 0 2a 1 2a 2 gnd 2a 3 2a 4 2a 5 v cc 2a 6 2a 7 gnd 2e ab 2le ab 1oe ba 1le ba 1e ba gnd 1b 0 1b 1 v cc 1b 2 1b 3 1b 4 gnd 1b 5 1b 6 1b 7 2b 0 2b 1 2b 2 gnd 2b 3 2b 4 2b 5 v cc 2b 6 2b 7 gnd 2e ba 2le ba 2oe ba 2oe ab 1oe ab 1le ab 1e ab fig.2 bus hold circuit. handbook, halfpage to internal circuit mna300 v cc data input
1999 nov 23 5 philips semiconductors product speci?cation 16-bit d-type registered transceiver; 3-state 74ALVCH16543 fig.3 logic symbol. handbook, full pagewidth mna298 2a 0 2a 1 2a 2 2a 3 2a 4 2a 5 2a 6 2a 7 2oe ba 2oe ab 2e ab 2e ba 2le ab 2le ba 2b 0 2b 1 2b 2 2b 3 2b 4 2b 5 2b 6 2b 7 41 42 40 38 37 36 34 33 16 15 17 19 20 21 23 24 29 28 26 31 27 30 1a 0 1a 1 1a 2 1a 3 1a 4 1a 5 1a 6 1a 7 1oe ba 1oe ab 1e ab 1e ba 1le ab 1le ba 1b 0 1b 1 1b 2 1b 3 1b 4 1b 5 1b 6 1b 7 51 52 49 48 47 45 44 43 6 5 8 9 10 12 13 14 56 1 3 54 2 55 fig.4 iec logic symbol. handbook, full pagewidth mna299 4 5 6d 5d 52 3 g1 2en4 1c5 56 55 1en3 1 g2 2c6 54 2 3 651 8 49 9 48 10 47 12 45 13 44 14 43 10 15 12d 11d 42 9 g10 c9 29 30 en8 [ ab ] en7 [ ba ] 31 g12 c11 28 26 27 16 41 17 40 19 38 20 37 21 36 23 34 24 33
1999 nov 23 6 philips semiconductors product speci?cation 16-bit d-type registered transceiver; 3-state 74ALVCH16543 fig.5 logic diagram (one section). handbook, full pagewidth mna301 8 identical channels le d le d to 7 other channels noe ab noe ab ne ab ne ba nle ab nle ba na 1 nb 1
1999 nov 23 7 philips semiconductors product speci?cation 16-bit d-type registered transceiver; 3-state 74ALVCH16543 recommended operating conditions limiting values in accordance with the absolute maximum rating system (iec 134); voltages are referenced to gnd (ground = 0 v). note 1. the input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. above 55 c the value of p tot derates linearly with 8 mw/k. symbol parameter conditions min. typ. max. unit v cc dc supply voltage for maximum speed performance c l = 30 pf 2.3 2.5 2.7 v for maximum speed performance c l = 50 pf 3.0 3.3 3.6 v for low-voltage applications 1.2 2.4 3.6 v v i dc input voltage 0 - v cc v v o dc output voltage 0 - v cc v t amb operating ambient temperature in free air - 40 - +85 c t r , t f input rise and fall times v cc = 2.3 to 3.0 v 0 - 20 ns/v v cc = 3.0 to 3.6 v 0 - 10 ns/v symbol parameter conditions min. max. unit v cc dc supply voltage - 0.5 +4.6 v i ik dc input diode current v i <0 -- 50 ma v i dc input voltage note 1 - 0.5 +4.6 v i ok dc output diode current v o >v cc or v o <0 - 50 ma v o dc output voltage note 1 - 0.5 v cc + 0.5 v i o dc output source or sink current v o =0tov cc - 50 ma i cc , i gnd dc v cc or gnd current - 100 ma t stg storage temperature - 65 +150 c p tot power dissipation for temperature range: - 40 to +125 c; note 2 - 600 mw
1999 nov 23 8 philips semiconductors product speci?cation 16-bit d-type registered transceiver; 3-state 74ALVCH16543 dc characteristics over recommended operating conditions; voltages are referenced to gnd (groun d=0v). notes 1. all typical values are measured at t amb =25 c. 2. valid for data inputs of bus hold parts. symbol parameter test conditions t amb = - 40 to +85 c unit v i (v) other v cc (v) min. typ. (1) max. v ih high-level input voltage 2.3 to 2.7 1.7 1.2 - v 2.7 to 3.6 2.0 1.5 - v v il low-level input voltage 2.3 to 2.7 - 1.2 0.7 v 2.7 to 3.6 - 1.5 0.8 v v oh high-level output voltage v ih or v il i o = - 100 m a 2.3 to 3.6 v cc - 0.2 v cc - v i o = - 6 ma 2.3 v cc - 0.3 v cc - 0.08 - v i o = - 12 ma 2.3 v cc - 0.6 v cc - 0.26 - v i o = - 12 ma 2.7 v cc - 0.5 v cc - 0.14 - v i o = - 12 ma 3.0 v cc - 0.6 v cc - 0.09 - v i o = - 24 ma 3.0 v cc - 1.0 v cc - 0.28 - v v ol low-level output voltage v ih or v il i o = 100 m a 2.3 to 3.6 - gnd 0.20 v i o =6ma 2.3 - 0.07 0.40 v i o =12ma 2.3 - 0.15 0.70 v i o =12ma 2.7 - 0.14 0.40 v i o =24ma 3.0 - 0.27 0.55 v i l input leakage current v cc or gnd 2.3 to 3.6 - 0.1 5 m a i oz 3-state output off-state current v ih or v il v o =v cc or gnd 2.3 to 3.6 - 0.1 10 m a i cc quiescent supply voltage v cc or gnd i o = 0 2.3 to 3.6 - 0.2 40 m a d i cc additional quiescent supply current given per data i/o pin with bus hold v cc - 0.6 i o = 0 2.3 to 3.6 - 150 750 m a i bhl bus hold low sustaining current 0.7 (2) 2.3 (2) 45 -m a 0.8 (2) 3.0 (2) 75 150 i bhh bus hold high sustaining current 1.7 (2) 2.3 (2) - 45 m a 2.0 (2) 3.0 (2) - 75 - 175 i bhlo bus hold low overdrive current 3.6 (2) 500 m a i bhho bus hold low overdrive current 3.6 (2) - 500 m a
1999 nov 23 9 philips semiconductors product speci?cation 16-bit d-type registered transceiver; 3-state 74ALVCH16543 ac characteristics for v cc = 2.3 to 2.7 v ground = 0 v; t r =t f 2.0 ns; c l =30pf. note 1. all typical values are measured at t amb =25 c and v cc = 2.5 v. symbol parameter test conditions t amb = - 40 to +85 c unit waveforms v cc (v) min. typ. (1) max. t phl /t plh propagation delay na n ,nb n to nb n ,na n see figs 6 and 10 2.3 to 2.7 1.0 3.4 5.1 ns propagation delay n le ab ,n le ba to nb n ,na n see figs 7 and 10 2.3 to 2.7 1.0 3.3 6.5 ns t pzh /t pzl 3-state output enable time n oe ba ,n oe ab to na n , nb n see figs 8 and 10 2.3 to 2.7 1.0 3.3 6.8 ns t phz /t plz 3-state output disable time n oe ba ,n oe ab to na n , nb n see figs 8 and 10 2.3 to 2.7 1.0 2.9 5.7 ns t pzh /t pzl 3-state output enable time n e ba ,n e ab to na n , nb n see figs 8 and 10 2.3 to 2.7 1.0 3.3 7.2 ns t phz /t plz 3-state output disable time n e ba ,n e ab to na n , nb n see figs 8 and 10 2.3 to 2.7 1.3 3.3 6.1 ns t w n le xx pulse width low see figs 7 and 10 2.3 to 2.7 3.3 1.2 - ns t su set-up time na n ,nb n to n le xx ,n e xx see figs 9 and 10 2.3 to 2.7 1.2 0.2 - ns t h hold time na n ,nb n to n le xx ,n e xx see figs 9 and 10 2.3 to 2.7 1.2 0.2 - ns
1999 nov 23 10 philips semiconductors product speci?cation 16-bit d-type registered transceiver; 3-state 74ALVCH16543 ac characteristics for v cc = 2.7 v and v cc = 3.0 v to 3.6 v ground = 0 v; t r =t f 2.5 ns; c l =50pf. notes 1. all typical values are measured at t amb =25 c. 2. typical values at v cc = 3.0 v. symbol parameter test conditions t amb = - 40 to +85 c unit waveforms v cc (v) min. typ. (1) max. t phl /t plh propagation delay na n ,nb n to nb n ,na n see figs 6 and 10 2.7 - 2.9 4.8 ns 3.0 to 3.6 1.0 3.8 (2) 4.3 ns propagation delay nle ab ,n le ba to nb n ,na n see figs 7 and 10 2.7 - 3.6 6.2 ns 3.0 to 3.6 1.4 3.1 (2) 5.0 ns t pzh /t pzl 3-state output enable time n oe ba ,n oe ab to na n , nb n see figs 8 and 10 2.7 - 3.4 6.3 ns 3.0 to 3.6 1.0 2.9 (2) 5.3 ns t phz /t plz 3-state output disable time n oe ba ,n oe ab to na n , nb n see figs 8 and 10 2.7 - 3.3 4.8 ns 3.0 to 3.6 1.0 3.2 (2) 4.6 ns t pzh /t pzl 3-state output enable time ne ba ,ne ab to na n , nb n see figs 8 and 10 2.7 - 3.5 6.9 ns 3.0 to 3.6 1.0 3.0 (2) 5.6 ns t phz /t plz 3-state output disable time n e ba ,n e ab to na n , nb n see figs 8 and 10 2.7 - 3.5 6.2 ns 3.0 to 3.6 1.1 3.3 (2) 5.1 ns t w n le xx pulse width low see figs 7 and 10 2.7 3.3 1.3 - ns 3.0 to 3.6 3.3 0.9 (2) - ns t su set-up time na n ,nb n to nle xx , ne xx see figs 9 and 10 2.7 0.8 0.2 - ns 3.0 to 3.6 1.3 0.1 (2) - ns t h hold time na n ,nb n to n le xx ,n e xx see figs 9 and 10 2.7 0.4 0.1 - ns 3.0 to 3.6 0.7 0.2 (2) - ns
1999 nov 23 11 philips semiconductors product speci?cation 16-bit d-type registered transceiver; 3-state 74ALVCH16543 ac waveforms notes: v cc = 2.3 to 2.7 v v m = 0.5v cc ; v x =v ol + 150 mv; v y =v oh - 150 mv; v i =v cc ; v ol and v oh are typical output voltage drop that occur with the output load. notes: v cc = 3.0 to 3.6 v and v cc = 2.7 v v m = 1.5 v; v x =v ol + 300 mv; v y =v oh - 300 mv; v i = 2.7 v; v ol and v oh are typical output voltage drop that occur with the output load. fig.6 the inputs na n , nb n to outputs nb n , na n propagation delay times. handbook, halfpage mna302 na n , nb n input nb n , na n output t phl t plh gnd v i v m v m v oh v ol fig.7 the latch enable inputs n le xx pulse width, the latch enable inputs to output nb n , na n propagation delays. handbook, full pagewidth mna303 t phl t plh t w v m v m nle xx input na n , nb n output gnd v i v oh v ol
1999 nov 23 12 philips semiconductors product speci?cation 16-bit d-type registered transceiver; 3-state 74ALVCH16543 fig.8 the 3-state enable and disable times. handbook, full pagewidth mna304 t plz t phz outputs disabled outputs enabled v y v x outputs enabled output low-to-off off-to-low output high-to-off off-to-high noe xx , ne xx input v i v ol v oh v cc v m gnd gnd t pzl t pzh v m v m fig.9 the data set-up and hold times for the na n , nb n input to the n le xx input. handbook, full pagewidth t h t su t h t su v m v m mna305 gnd v i gnd v i nle xx , ne xx input na n , nb n input
1999 nov 23 13 philips semiconductors product speci?cation 16-bit d-type registered transceiver; 3-state 74ALVCH16543 fig.10 test circuitry for switching times. handbook, full pagewidth open gnd 50 pf 2 v cc v cc v i v o mna296 d.u.t. c l r t r l 500 w r l 500 w pulse generator s1 v cc v i <2.7 v v cc 2.7 to 3.6 v 2.7 v test s1 t plh /t phl open t plz /t pzl 2 v cc t phz /t pzh gnd definitions for test circuit. c l = load capacitance including jig and probe capacitance (see chapter ac characteristics) r l = load resistance. r t = termination resistance should be equal to the output impedance z o of the pulse generator.
1999 nov 23 14 philips semiconductors product speci?cation 16-bit d-type registered transceiver; 3-state 74ALVCH16543 package outline unit a 1 a 2 a 3 b p cd (1) e (2) eh e ll p qz y w v q references outline version european projection issue date iec jedec eiaj mm 0.15 0.05 0.2 0.1 8 0 o o 0.1 dimensions (mm are the original dimensions). notes 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. plastic interlead protrusions of 0.25 mm maximum per side are not included. sot364-1 93-02-03 95-02-10 w m q a a 1 a 2 d l p q detail x e z e c l x (a ) 3 0.25 128 56 29 y pin 1 index b h 1.05 0.85 0.28 0.17 0.2 0.1 14.1 13.9 6.2 6.0 0.5 1.0 8.3 7.9 0.50 0.35 0.5 0.1 0.08 0.25 0.8 0.4 p e v m a a tssop56: plastic thin shrink small outline package; 56 leads; body width 6.1 mm sot364-1 a max. 1.2 0 2.5 5 mm scale mo-153ee
1999 nov 23 15 philips semiconductors product speci?cation 16-bit d-type registered transceiver; 3-state 74ALVCH16543 soldering introduction to soldering surface mount packages this text gives a very brief insight to a complex technology. a more in-depth account of soldering ics can be found in our data handbook ic26; integrated circuit packages (document order number 9398 652 90011). there is no soldering method that is ideal for all surface mount ic packages. wave soldering is not always suitable for surface mount ics, or for printed-circuit boards with high population densities. in these situations reflow soldering is often used. re?ow soldering reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. typical reflow peak temperatures range from 215 to 250 c. the top-surface temperature of the packages should preferable be kept below 230 c. wave soldering conventional single wave soldering is not recommended for surface mount devices (smds) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. to overcome these problems the double-wave soldering method was specifically developed. if wave soldering is used the following conditions must be observed for optimal results: use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. for packages with leads on two sides and a pitch (e): C larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; C smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves at the downstream end. for packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves downstream and at the side corners. during placement and before soldering, the package must be fixed with a droplet of adhesive. the adhesive can be applied by screen printing, pin transfer or syringe dispensing. the package can be soldered after the adhesive is cured. typical dwell time is 4 seconds at 250 c. a mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. manual soldering fix the component by first soldering two diagonally-opposite end leads. use a low voltage (24 v or less) soldering iron applied to the flat part of the lead. contact time must be limited to 10 seconds at up to 300 c. when using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 c.
1999 nov 23 16 philips semiconductors product speci?cation 16-bit d-type registered transceiver; 3-state 74ALVCH16543 suitability of surface mount ic packages for wave and re?ow soldering methods notes 1. all surface mount (smd) packages are moisture sensitive. depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). for details, refer to the drypack information in the data handbook ic26; integrated circuit packages; section: packing methods . 2. these packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. if wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. the package footprint must incorporate solder thieves downstream and at the side corners. 4. wave soldering is only suitable for lqfp, tqfp and qfp packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. wave soldering is only suitable for ssop and tssop packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. definitions life support applications these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips for any damages resulting from such improper use or sale. package soldering method wave reflow (1) bga, sqfp not suitable suitable hlqfp, hsqfp, hsop, htssop, sms not suitable (2) suitable plcc (3) , so, soj suitable suitable lqfp, qfp, tqfp not recommended (3)(4) suitable ssop, tssop, vso not recommended (5) suitable data sheet status objective speci?cation this data sheet contains target or goal speci?cations for product development. preliminary speci?cation this data sheet contains preliminary data; supplementary data may be published later. product speci?cation this data sheet contains ?nal product speci?cations. limiting values limiting values given are in accordance with the absolute maximum rating system (iec 134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the speci?cation is not implied. exposure to limiting values for extended periods may affect device reliability. application information where application information is given, it is advisory and does not form part of the speci?cation.
1999 nov 23 17 philips semiconductors product speci?cation 16-bit d-type registered transceiver; 3-state 74ALVCH16543 notes
1999 nov 23 18 philips semiconductors product speci?cation 16-bit d-type registered transceiver; 3-state 74ALVCH16543 notes
1999 nov 23 19 philips semiconductors product speci?cation 16-bit d-type registered transceiver; 3-state 74ALVCH16543 notes
? philips electronics n.v. sca all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owne r. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not con vey nor imply any license under patent- or other industrial or intellectual property rights. internet: http://www.semiconductors.philips.com 1999 68 philips semiconductors C a worldwide company for all other countries apply to: philips semiconductors, international marketing & sales communications, building be-p, p.o. box 218, 5600 md eindhoven, the netherlands, fax. +31 40 27 24825 argentina: see south america australia: 3 figtree drive, homebush, nsw 2140, tel. +61 2 9704 8141, fax. +61 2 9704 8139 austria: computerstr. 6, a-1101 wien, p.o. box 213, tel. +43 1 60 101 1248, fax. +43 1 60 101 1210 belarus: hotel minsk business center, bld. 3, r. 1211, volodarski str. 6, 220050 minsk, tel. +375 172 20 0733, fax. +375 172 20 0773 belgium: see the netherlands brazil: see south america bulgaria: philips bulgaria ltd., energoproject, 15th floor, 51 james bourchier blvd., 1407 sofia, tel. +359 2 68 9211, fax. +359 2 68 9102 canada: philips semiconductors/components, tel. +1 800 234 7381, fax. +1 800 943 0087 china/hong kong: 501 hong kong industrial technology centre, 72 tat chee avenue, kowloon tong, hong kong, tel. +852 2319 7888, fax. +852 2319 7700 colombia: see south america czech republic: see austria denmark: sydhavnsgade 23, 1780 copenhagen v, tel. +45 33 29 3333, fax. +45 33 29 3905 finland: sinikalliontie 3, fin-02630 espoo, tel. +358 9 615 800, fax. +358 9 6158 0920 france: 51 rue carnot, bp317, 92156 suresnes cedex, tel. +33 1 4099 6161, fax. +33 1 4099 6427 germany: hammerbrookstra?e 69, d-20097 hamburg, tel. +49 40 2353 60, fax. +49 40 2353 6300 hungary: see austria india: philips india ltd, band box building, 2nd floor, 254-d, dr. annie besant road, worli, mumbai 400 025, tel. +91 22 493 8541, fax. +91 22 493 0966 indonesia: pt philips development corporation, semiconductors division, gedung philips, jl. buncit raya kav.99-100, jakarta 12510, tel. +62 21 794 0040 ext. 2501, fax. +62 21 794 0080 ireland: newstead, clonskeagh, dublin 14, tel. +353 1 7640 000, fax. +353 1 7640 200 israel: rapac electronics, 7 kehilat saloniki st, po box 18053, tel aviv 61180, tel. +972 3 645 0444, fax. +972 3 649 1007 italy: philips semiconductors, via casati, 23 - 20052 monza (mi), tel. +39 039 203 6838, fax +39 039 203 6800 japan: philips bldg 13-37, kohnan 2-chome, minato-ku, tokyo 108-8507, tel. +81 3 3740 5130, fax. +81 3 3740 5057 korea: philips house, 260-199 itaewon-dong, yongsan-ku, seoul, tel. +82 2 709 1412, fax. +82 2 709 1415 malaysia: no. 76 jalan universiti, 46200 petaling jaya, selangor, tel. +60 3 750 5214, fax. +60 3 757 4880 mexico: 5900 gateway east, suite 200, el paso, texas 79905, tel. +9-5 800 234 7381, fax +9-5 800 943 0087 middle east: see italy netherlands: postbus 90050, 5600 pb eindhoven, bldg. vb, tel. +31 40 27 82785, fax. +31 40 27 88399 new zealand: 2 wagener place, c.p.o. box 1041, auckland, tel. +64 9 849 4160, fax. +64 9 849 7811 norway: box 1, manglerud 0612, oslo, tel. +47 22 74 8000, fax. +47 22 74 8341 pakistan: see singapore philippines: philips semiconductors philippines inc., 106 valero st. salcedo village, p.o. box 2108 mcc, makati, metro manila, tel. +63 2 816 6380, fax. +63 2 817 3474 poland : al.jerozolimskie 195 b, 02-222 warsaw, tel. +48 22 5710 000, fax. +48 22 5710 001 portugal: see spain romania: see italy russia: philips russia, ul. usatcheva 35a, 119048 moscow, tel. +7 095 755 6918, fax. +7 095 755 6919 singapore: lorong 1, toa payoh, singapore 319762, tel. +65 350 2538, fax. +65 251 6500 slovakia: see austria slovenia: see italy south africa: s.a. philips pty ltd., 195-215 main road martindale, 2092 johannesburg, p.o. box 58088 newville 2114, tel. +27 11 471 5401, fax. +27 11 471 5398 south america: al. vicente pinzon, 173, 6th floor, 04547-130 s?o paulo, sp, brazil, tel. +55 11 821 2333, fax. +55 11 821 2382 spain: balmes 22, 08007 barcelona, tel. +34 93 301 6312, fax. +34 93 301 4107 sweden: kottbygatan 7, akalla, s-16485 stockholm, tel. +46 8 5985 2000, fax. +46 8 5985 2745 switzerland: allmendstrasse 140, ch-8027 zrich, tel. +41 1 488 2741 fax. +41 1 488 3263 taiwan: philips semiconductors, 6f, no. 96, chien kuo n. rd., sec. 1, taipei, taiwan tel. +886 2 2134 2886, fax. +886 2 2134 2874 thailand: philips electronics (thailand) ltd., 209/2 sanpavuth-bangna road prakanong, bangkok 10260, tel. +66 2 745 4090, fax. +66 2 398 0793 turkey: yukari dudullu, org. san. blg., 2.cad. nr. 28 81260 umraniye, istanbul, tel. +90 216 522 1500, fax. +90 216 522 1813 ukraine : philips ukraine, 4 patrice lumumba str., building b, floor 7, 252042 kiev, tel. +380 44 264 2776, fax. +380 44 268 0461 united kingdom: philips semiconductors ltd., 276 bath road, hayes, middlesex ub3 5bx, tel. +44 208 730 5000, fax. +44 208 754 8421 united states: 811 east arques avenue, sunnyvale, ca 94088-3409, tel. +1 800 234 7381, fax. +1 800 943 0087 uruguay: see south america vietnam: see singapore yugoslavia: philips, trg n. pasica 5/v, 11000 beograd, tel. +381 11 62 5344, fax.+381 11 63 5777 printed in the netherlands 245004/02/pp 20 date of release: 1999 nov 23 document order number: 9397 750 05255

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